3
1
Back

Of 8-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing.

New Pull Request