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BackTSSOP10: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET SB MOSFET Infineon PLCC, 20 pins, surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching through hole PLCC, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3, Wuerth electronics 9774070951 (https://katalog.we-online.de/em/datasheet/9774070951.pdf), generated with kicad-footprint-generator JST SHL series connector, 502443-1270 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB locator, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 15 Circuits (https://www.molex.com/pdm_docs/sd/5022311500_sd.pdf molex FFC/FPC connector Pitch 0.5mm Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 176 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2191, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with.
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