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Back4 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 4 pin, Right Angle, Surface Mount, ZIF, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0160, 16 Circuits (https://www.molex.com/pdm_docs/sd/2005280160_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 44 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-05A example for new part number: A-41791-0010 example for new part number: AE-6410-04A example for new part number: A-41791-0005 example for new part number: A-41792-0014 example for new part number: 22-27-2131, 13 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.25 mm² wires.
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