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Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_12_%2005-08-1855.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package (MF) - 6x5 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink small outline package; 8 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/2451fg.pdf#page=17), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-10DP-0.5V, 10 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-170 , 10 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator connector Wago side entry Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-794073-x, 4 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated.

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