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README.md 2015-02-23 04:37:33 -08:00 It's really just a quick and dirty content rewriting engine with code already written for about a dozen webcomics. Examples: * Least I Could Do Envelope/Envelope.kicad_pcb Normal file Unescape Hardware/Panel/precadsr-panel/precadsr-panel.sch Normal file Unescape Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CuBottom.gbl Normal file Unescape "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_cap.stl Normal file View File Schematics/Unseen Servant/Unseen Servant Front Panel v2.kicad_pcb Normal file View File 3D Printing/Pot_Knobs/knob.scad Executable file View File # Format documentation: http://kicad-pcb.org/help/file-formats/ # Temporary files *.000 *.bak *.bck *.kicad_pcb-bak *.kicad_sch-bak *-backups */fp-info-cache *.kicad_prl *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Autorouter files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/DIP-6_W7.62mm_Socket_LongPads.kicad_mod Normal file Unescape Drill report for precadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes Total unplated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View.

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