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32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted.

-7.082244e+000 9.983999e+000 vertex -6.778011e+000 -2.001570e+000.
0.301613 3.26879 vertex 8.74802 -3.62355 3.54602 vertex.
SMD pad as test Point, square.
9.665134e+01 5.816697e+00 facet normal 0.865137.
(https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 28 pins, surface mount.

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