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Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter.

• (see Microchip Packaging Specification 00000049BS.pdf.
• 4.3307094,5.905513 h 0.393701" d="M 2.9527563,1.5748029 V 1.181102.
• Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115.

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