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SIPAK Horizontal RM 2.54mm TO-220-4, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-7, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 2.54mm, staggered type-2 TO-220-7 Horizontal RM 1.7mm staggered type-1 TO-220-11, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 2.54mm TO-220F-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 3.81mm TO-264-5, Vertical, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm TO-220-4, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 0.9mm staggered type-2 TO-220F-15, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MT MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, with latches, PN:G125-MVX0605L1X Harwin Gecko Connector, 10 pins, dual row male, vertical entry Harwin LTek Connector, 14 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils.

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