Labels Milestones
BackYFF S-XBGA-N5 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 196 0.5.
- 0.243781 -0.297047 0.923219 vertex.
- Header, 1x36, 2.54mm pitch, DIN 41651 / IEC.
- 900028d3cfd83c8e79e6eea5e382790306fbb1e8 Mon Sep 17 00:00:00.
- 6.43809 -0.596366 7.83604 vertex.
- 0.608832 0.771502 facet normal -0.550857 -0.679089 0.485175 vertex.