Labels Milestones
BackMar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: unplated through holes: merged pull request 'Put title box in PDF export' (#4) from schematic into main v1 Final tweaks, version submitted to JLCPCB on 20240124 Final tweaks, version submitted to Licensor for.
- Toyocom TSX-3225 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, hand-soldering, 3.2x2.5mm^2.
- Normal 0.13748 0.572633 0.808202.
- -0.012671 0.705364 0.708732 vertex -7.28282 0.821781 7.24568 facet.
- 4.341105e-01 -1.679270e-03 -9.008581e-01 facet normal 4.856502e-001.
- For: GMSTBVA_2,5/10-G-7,62; number of pins: 04.