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CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x31, 2.00mm pitch, double rows Surface mounted pin header SMD 2x35 1.27mm double row Through hole angled socket strip THT 2x14 2.00mm double row Through hole pin header THT 1x23 2.00mm single row Through hole socket strip SMD 1x35 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x26 1.00mm single row style2 pin1 right Through hole straight pin header, 2x01, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x17, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x28, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x34 2.00mm single row Through hole straight pin header, 2x07, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x34 1.27mm.

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