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Back"Layer B.Cu" "Notes": "Layer B.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Mask" "Notes": "Layer F.Mask" "Notes": "Layer B.Paste" "Notes": "Layer F.Paste" "Notes": "Layer F.Mask" "Notes": "Layer F.Paste" "Notes": "Layer F.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer B.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Notes from MK's PCB livestream - avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals PCB layout: make power connection traces larger; MK uses a ground plane spokes can be the same as Infineon_AG-ECONO2, https://www.littelfuse.com/~/media/electronics/datasheets/power_semiconductors/littelfuse_power_semiconductor_igbt_module_mg1225h_xn2mm_datasheet.pdf.pdf 24-lead TH, Package H, same as Infineon_EasyPIM-2B, https://www.st.com/resource/en/datasheet/a2c25s12m3.pdf 35-lead TH.
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