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10706, vertical (cable from top), 7 pins, pitch 5mm, size 62.3x14mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new part number: 5273-04A example for new part number: 22-27-2101, 10 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Single banana socket, footprint - 3 5mm LEDs -Consider: 1 simple on/off switch/button/knob/etc. - 2 pin Molex header 2.54 mm spacing D Switch, three position, dual pole double throw K switch dual double-pole single-throw OFF-ON D Single Pole Single Throw (SPST) switch, small symbol D 6x DIP Switch, Single Pole Single Throw (DPST) Switch K switch normally-open pushbutton push-button Lamp D Push button switch with Signal Lamp, generic K switch normally-open pushbutton push-button D Push button switch with Signal Lamp, generic K switch normally-open pushbutton push-button LED D MEC 5G single pole double throw, separate symbols | | Q1, Q2, Q3, Q4, Q5 R1, R2, R23, R24 R3, R21, R27, R28 R4, R6, R7 | 2 | 1N5817 | Schottky diode | Tayda | A-1955 | | | | | R3, R21, R27, R28 R4, R6, R7, R30, R31 Switch, dual pole double throw, separate symbols Quad Low-Noise JFET-Input Operational Amplifiers, DIP-8/SOIC-8/TO-99-8 | | U2 | 1 | SW_DPDT_x2 | Switch, triple pole double throw, separate symbols K switch SPST right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.ti.com/lit/ds/symlink/lm4990.pdf WSON, 12 Pin (http://kionixfs.kionix.com/en/document/TN008-PCB-Design-Guidelines-for-2x2-LGA-Sensors.pdf#page=4), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface.

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