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Bump 4x3 grid, NSMD pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm.

• 5.59382 4.18518 7.89166 facet normal 1.950737e-01 9.807886e-01.
• -3.529849e-04 vertex -9.858900e+01 9.181025e+01.
• Pitch 2.29x2.54mm, pin-PCB-offset 9.4mm, see.
• SD12k, style1, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_Sd12k.pdf Inductor Radial.
• Vertex -7.19919 0.932982 7.41293.

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