Labels Milestones
BackAltera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 22.86 mm (900 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST , Slide, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 0.9mm staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 3.81mm TO-264-5, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm staggered type-1.
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