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Pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, single row Through hole angled pin header THT 1x31 2.00mm single row style2 pin1 right Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 1x07 2.54mm single row Through hole straight pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through.

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