3
1
Back

Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 1x12 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x33, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x10 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x20, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x14, 2.54mm pitch, 8.51mm socket length, single row (from Kicad.

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