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Connector, 502386-0670 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Resistor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator ipc_noLead_generator.py TQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 54-lead TSOP typ II package TSSOP, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=10047&prodName=TLP3123), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-BE-LC, 20 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic Micro Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 56 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm staggered type-1 TO-220F-9, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 3.81mm TO-264-5, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-2, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 5.08mm TO-220-3, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 2.54mm TO-220-4 Vertical RM 0.9mm staggered type-2 TO-220F-7, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 18-lead though-hole mounted high-volatge DIP package (based on.

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