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Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [HTSSOP], with thermal pad TSSOP HTSSOP 0.65 thermal.

• TO-252 TO-263 TO-268 23x13 mm SMD heatsink.
• MCV_1,5/10-GF-3.5; number of pins: 16; pin pitch.

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