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BackSBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Surface mounted socket strip SMD 1x39 1.27mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x09 1.27mm double row Through hole angled socket strip SMD 1x23 2.54mm single row Surface mounted pin header THT 2x27 2.54mm double row Through hole angled pin header THT 2x05 2.54mm double row surface-mounted straight pin header, 2x12, 2.54mm pitch, double rows Surface mounted socket strip THT 1x22 2.00mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 6 pins, pitch 7.5mm, size 122x14mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00001_DB_EN.pdf, script-generated using.
- B10P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator.
- NEITHER RECIPIENT NOR ANY CONTRIBUTORS.
- Rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x15.