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IHxxxxD, DIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect.

• Square 2.0mm_Drill1.0mm side length, hole.
• Transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%202_6-p_e%20v5.pdf LEM HX10-NP hall effect.
• 0.261859 7.03804 facet normal 0.0822467 0.0560748 -0.995033.
• Module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT.
• B DIN41612 connector, type.

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