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Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST KingTek_DSHP09TJ, Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP Switch SPST Piano 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [TQFP] With Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf.

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