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(T1655-2)), generated with kicad-footprint-generator connector Molex Mini-Fit_Jr side entry Molex Nano-Fit Power Connectors, old mpn/engineering number: 5566-16A, example for new part number: 5273-08A example for new part number: AE-6410-02A example for new part number: 26-60-5080, 8 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-09P-1.25DSA, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S_Wide package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket.

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