3
1
Back

2.5mm solder Pin_ diameter 1.0mm, hole diameter 2.0mm THT pad as test Point, diameter 2.0mm SMD pad SMD pad as test point, pitch 5.08mm, size 50.8x10.6mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SPOX Connector System, 43045-1621 (alternative finishes: 43045-102x), 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.

New Pull Request