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ST 20-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator Connector Phoenix Contact SPT 2.5/3-H-5.0-EX Terminal Block, 1719325 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719325), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-08A example for new part number: A-41792-0005 example for new part number: 26-60-4060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 8.6, Wuerth electronics 9774040360 (https://katalog.we-online.de/em/datasheet/9774040360.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 3.5.

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