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Stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/PCB/precadsr/potsetc.sch Normal file View File 3D Printing/Cases/Eurorack Modular Case/DSC03766.JPG Executable file View File 3D Printing/Pot_Knobs/pot_knob-6mm-clear.stl Executable file View File 3D Printing/Tools/Eurorack_Nut_Driver_10mm.stl Executable file View File Hardware/PCB/precadsr_Gerbers/precadsr-Edge_Cuts.gbr Normal file Unescape threeUHeight = 133.35; //overall 3u height offsetToMountHoleCenterX=hp;//1hp margin on each side module.

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