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BackTHT rectangular pad as test Point, diameter 3.0mm z-position of LED center 3.0mm, 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm 2 pins IR-ED, diameter 3.0mm, 2 pins diameter 10.0mm 3 pins UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf DFN package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf.
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