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32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 32-lead though-hole mounted DIP package, row.

• -5.61897 2.58057 vertex 7.20568 7.20568.
• Http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 7.9x3.8mm^2 package SMD Crystal MicroCrystal CM9V-T1A.

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