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Plasic small outline package; 28 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, S08B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST GH series connector, B11B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with.

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