Labels Milestones
BackSB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled socket strip, 1x10, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x17, 2.54mm pitch, single row Through hole straight.
- Type086_RT03403HBLC, 3 pins, pitch 2.54mm.
- 1.178409e-001 facet normal 0.0546376 0.554748 0.830223 facet normal.
- REPAIR OR CORRECTION. 12. IN.
- 10/100 Base-T, Cetus, used.
- Connector, Modjack, RJ45 (https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/c-bmj-0102.pdf Shielded, 2 LEDs.