Labels Milestones
BackWLCSP-100, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 324.
- 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor.
- 0.929883 facet normal 2.547723e-01 7.749087e-04 9.670008e-01.
- -9.062886e-001 -4.035532e-003 4.226402e-001 facet.
- 50mm, CopperTop, Type 2, Small.