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BackPackage (8E) - 4x4x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 4x4x0.9 mm Body [TQFP] With Exposed Pad Variation BB; (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16 Pin.
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