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BackHttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081932_0_UHE28.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0370 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.15 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.5mm, size 11.2x7mm^2, drill diamater 1.1mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00013 pitch 5mm size 30x10mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00082 vertical pitch 2.5mm size 5.5x5mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix MKDS-1,5-10-5.08 pitch 5.08mm size 30.5x8.45mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00300 pitch 10mm size 105x8.1mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00015, 5 pins, pitch 3.81mm, hole diameter 1.0mm, wire diameter 0.8mm Test point with 2 copper strips net tie solder jumper bridged SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x34 1.00mm single row Through hole socket strip THT 1x18 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x06 1.27mm single row Through hole angled socket strip, 2x25, 2.54mm pitch, single row Surface mounted pin header SMD 1x12 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x26, 2.00mm pitch, double rows Surface mounted pin header THT 2x39 1.00mm double row Through hole angled pin header SMD 1x07 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled.
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