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Readerc.go scannerc.go writerc.go yamlh.go yamlprivateh.go Copyright (c) 2005-2008 Dustin Sallings Permission is hereby granted, free of charge, to any person obtaining a copy THE SOFTWARE. Copyright (c) 2013-2020 Khan Academy and other contributors Based on a medium customarily used for a single 0.25 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF11-26DP-2DSA, 13 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 68 pins, through hole 3.3mm, height 2.5, Wuerth electronics 9775031960 (https://katalog.we-online.com/em/datasheet/9775031960.pdf), generated with kicad-footprint-generator Resistor SMD 2816 (7142 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-BE-A, 17 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator JST XA series connector, LY20-30P-DLT1, 15 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad.

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