synth_tools

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Repique/caixa, two or three for surdos row_2 = row_1 + vertical_space/7; cv_in_1a = [left_col, row_5, 0]; cv_in_2a = [left_col, row_7, 0]; cv_in_1b = [right_col, row_5, 0]; audio_out_1 = [right_col, row_5, 0]; cv_in_2a = [left_col, row_1, 0]; pwm_in = [input_column - h_margin/2, row_1, 0]; square_out = [output_column, row_2, 0]; fm_in = [h_margin+working_width/8, row_4, 0]; pwm_cv_lvl = [width_mm - h_margin - working_width/8, row_2, 0]; fm_in = [h_margin+working_width/8, row_2, 0]; pwm_in = [width_mm - h_margin - working_width/8, row_3, 0]; pwm_duty = [second_col, second_row, 0]; //Third row interface placement f_tune = [second_col, first_row, 0]; c_tune = [width_mm/2 - h_margin, top_row, 0]; left_rib_x = thickness * 1; h_wall(h=4, l=right_rib_x); // bottom horizontal rib // middle horizontal rib h_wall(h=4, l=right_rib_x); // middle-bottom h rib pcb_holder(h=10, l=top_row-rail_clearance*2-15-thickness, th=1.15, wall_thickness=1); // lower h-rib reinforcer } Collect other files not yet released add more colors, for those main synth_tools/PSU/PSU.md 5 lines 1e09530d97 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png differ Binary files /dev/null and b/Docs/precadsr_layout_back.pdf differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' d8a7439c05979d3c73da6a91162e90a1a48a57e5 Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/UNSEEN SERVANT.png differ Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack Confirm barrel power jack Latest commits for file Schematics/SEQ_MANUAL_v2.pdf Update readme Add main pdf f45c980890 Go to file 6523065365 updates the potentiometer pads and thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm.

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