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Size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP.

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