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4.4mm socket length, double rows Through hole angled pin header SMD 1x19 2.00mm single row Through hole straight socket strip, 2x24, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted pin header THT 1x27 1.00mm single row Through hole pin header THT 1x17 1.00mm single row Through hole pin header THT 1x07 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x40 2.54mm single row Through hole socket strip THT 1x35 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x13 2.54mm double row Through hole angled socket strip, 2x34, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x20 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x13 2.00mm double row Through hole pin header THT 2x25 2.54mm double row Through hole angled pin header, 2x29, 1.00mm pitch, double rows Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, single row Through hole angled pin header THT 1x34 2.54mm single row style2 pin1 right Through hole angled pin header SMD 1x15 2.00mm single row Through hole straight socket strip, 2x16, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip, 1x18, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 1x20, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments BGA-289, 0.4mm pad, based on the GitHub page (they'll.

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