Labels Milestones
BackSpacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338.
- Count:** 76 Docs/precadsr_layout_back.pdf Normal.
- -7.46215 5.02581 3.82299 vertex -6.36396 6.36396 3 facet.