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23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments BGA-289, 0.4mm pad, based on https://www.schmitzbits.de/ms20.html which is good practice, but ho-dang what a mess romps with traces, vias, and net links romps with traces, vias, and net links Schematics/Unseen Servant/fp-info-cache Normal file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl Normal file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Male.png Executable file View File 3D Printing/Cases/Eurorack Modular Case History width = 38; // [1:1:84] /* [Holes] */ hole_dist_top = 2.5; rail_clearance = 8.5; // mm from very top/bottom edge and where it is if your 3PDT toggle switch, like mine, is a consideration. FDM printing is the diameter of the cylinder having the rounded.

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