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Pad 3.0x4.2mm, Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Piano, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf LQFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EA), generated with kicad-footprint-generator JST J2100 horizontal JST ZE series connector, B11P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket.

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