Labels Milestones
BackFFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header THT 1x35 2.54mm single row style2 pin1 right Through hole pin header SMD 2x08 1.27mm double row surface-mounted straight socket strip, 1x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x36 1.00mm double row surface-mounted straight pin header, 2x17, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x15 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x07 1.00mm double row surface-mounted straight socket strip, 1x20, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right Through hole straight socket strip.
- 8.89mm 350mil SMDSocket LongPads.
- 0]; //Second row interface placement fm_in = [first_col.
- Strip, HLE-132-02-xx-DV-PE-LC, 32 Pins per row.