Labels Milestones
BackCopper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4.
- 0.282966 0.360203 0.888923 facet normal -6.60207e-05 -0.115483 0.993309.
- Normal -0.365756 -0.300167 0.880978 vertex.
- Vertex -7.34599 -0.0206242 6.86125 facet.