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Connector, B8P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, S-PVSON-N10.

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