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EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (2mm x 3mm.

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