Labels Milestones
BackWire Wound Chip Common Mode Line Filter API Delevan, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 1.27mm staggered type-2 TO-220-7 Horizontal RM 2.54mm TO-220F-4, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-7, Horizontal, RM 2.54mm TO-247-4, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 2.54mm TO-220-4, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 5.45mm TO-264-3, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 5.45mm.
- Toyocom FA-238 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package.
- Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation.
- SMD SMT crystal Abracon ABM10 Abracon Miniature.
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