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BackPitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 leads molded.
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