Labels Milestones
Back4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-5, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 10.9mm TO-247-2, Vertical, RM 2.54mm, staggered type-1 TO-220-9 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.27mm, staggered type-1 TO-220F-5 Vertical RM 2.54mm TO-220-4, Horizontal, RM 2.286mm SIPAK Horizontal RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220-11, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.54mm TO-220F-4, Horizontal, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row.
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