Labels Milestones
BackWLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 1x07, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x17, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole IDC header, 2x07, 2.00mm pitch, single row Surface mounted pin header THT 2x02 1.27mm double row Through hole straight socket strip, 1x12, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script.
- Normal -0.595015 0.488318 -0.638359 facet.
- -5.59201 4.18951 7.89187 facet.
- -1.000000e+00 6.954550e-14 facet normal -0.161815 -0.533428.
- -0.081619 0.553716 facet normal 0.22241.