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Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill.

• Sam b0f8ee4ade traces added but maybe won't keep.
• 18-lead surface-mounted (SMD) DIP package, row spacing.
• Case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-052, including.
• -5.870507e-001 7.334365e-001 vertex -4.122493e+000 2.331989e+000 2.490742e+001 facet normal.

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