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Http://www.caltestelectronics.com/images/attachments/P315100rH_drawing.pdf DEUTSCH DT header 12 pin 3-pin CPU fan JWT A3963, 3.96mm pitch Pin head connector (http://www.jwt.com.tw/pro_pdf/A3963.pdf connector JWT A3963 pinhead 7.25mm SMT Multi-directional Spring Contact (T+R), https://cdn.harwin.com/pdfs/S1941R.pdf spring contact emi emc shield Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf tag connect programming header with bottom courtyard for TC2050-NL Clip board ; https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-IDC-NL_Datasheet_8.pdf https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-CLIP_Datasheet_25.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-NL%20Datasheet.pdf Tag-Connect programming header pogo pins Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf tag connect programming header with bottom courtyard for TC2050-NL Clip board ; https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-IDC-NL_Datasheet_8.pdf https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-CLIP_Datasheet_25.pdf Tag-Connect programming header with bottom courtyard for TC2050-NL Clip board ; https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-IDC-NL_Datasheet_8.pdf https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-CLIP_Datasheet_25.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2070-IDC%20Datasheet.pdf Connector XT30 Vertical PCB Female, https://www.tme.eu/en/Document/9b8d0c5eb7094295f3d3112c214d3ade/XT60PW%20SPEC.pdf 3.5 mm, Stereo, Right Angle, Surface Mount, ZIF, 15 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-2)), generated with kicad-footprint-generator JST GH series connector, 504050-1091 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Stretched Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems PSOF-7, 4.8x6.4mm Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100.

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